For the power grid

of the power grid

In the urban power grid, there are significant low and high frequency electrical interfering fields flowing from the power lines into the devices and then distributing to all Hi-Fi devices of the audio system via the cable connections.

In addition, directly within the domestic power grid there are critical electrical consumers (switching power supplies, computers, energy-saving lamps, refrigerators, heating systems, cooktops, routers, AV systems, etc.), which feed massive low and high-frequency interfering fields into the power grid distributing to all HiFi devices via the cables.

Common solution approaches and their limitations:

A common approach in the power sector is the use of line filters, conditioners and grid generators, which are operated in front of the Hi-Fi equipment, so that interfering fields should not reach the devices via the power grid.

However, current pulse peaks are often over 20 times the power consumption of the devices, so at a total power consumption of the audio system of only 500 W, the current pulse peaks can be over 10,000 W. Even generously designed with several 1000W line filters or grid generators therefore limit the dynamic flow of music in high-quality audio systems. Even with parallel current filters and not just in the signal path lying in-line power filters, it comes to transmission delay effects, since required components such as capacitors, diodes, etc. absorb energy and release it again with a time delay.

In addition, line filters often do not allow the inner interferences caused by the hi-fi devices themselves to escape to the outside due to their blocking function.

The use of common power-cleansing measures is always fraught with compromises that block the way to a higher level.

for the power grid

Verteiler & Netzelemente
für den Strombereich

ATOMIC BONDING vs. Monocyrstaline OCC / UPOCC Conductors

In contrast to the often only temporarily effective advantages of established treatment and manufacturing processes on the reproduction quality of high-quality audio cables, e.g. cryogenization or OCC or UPOCC casting processes, SCHNERZINGER cables with ATOMIC BONDING conductors enable an audibly purer and unrivaled true-to-life signal transmission - and this permanently! 

In order to recognize the essential advantage of the SCHNERZINGER ATOMIC BONDING technology compared to conventional methods, some background knowledge about the industrial processing of wires used as conductor material in the audio sector is required:


To manufacture the conductor material in most audio cables, thick copper or silver strands are repeatedly drawn through so-called drawing dies until the wires are thin enough for further use. Every drawing process means enormous mechanical stress, which causes the crystalline grain structure of the wires to disintegrate into many crystals. In a sense, the audio signals have to find their way through many of these grain structures. The flow through the grain boundaries from grain to grain creates an enormous resistance potential every time, which is known to cause slowed signal transport.

The more complex casting process is therefore often used for higher-quality audio cables. Here, liquid copper or silver is continuously poured into molds, which results in longer grain structures. In the even more complex monocrystalline OCC or UPOCC (Ultra-Pure Ohno Continuous Casting) process, the molds are even heated and slowly cooled to prevent the material from solidifying too quickly. This process was developed by Prof. Ohno in the 1980s for industry so that fewer cracks occur in the sheet metal when the copper strands are rolled out


SCHNERZINGER ATOMIC BONDING, on the other hand, takes a completely different approach:

To easily get the idea of the innovative development approach ATOMIC BONDING, simply envision a conducting wire as a pipe filled with ice cubes, whereby the ice cubes symbolically illustrate the inner grain structure of the wire.

Since long-chain metal structures are quite sensitive and easily disintegrate again after the manufacturing process, e.g. due to vibrations and bending processes, ATOMIC BONDING is a technologically extremely complex process which does not aim at bonding individual ice cubes to form a closed, long-chain monostructure, but on the contrary at crushing the cubes. This results in the smallest ice structure components, which can subsequently be compressed into a stable, homogeneous ice mass with very high cohesive forces in the tube.

A compacted, fused mass of ice has a closed, extremely stable structure - without any gaps. This fact forms the basis for a highly pure and perfect impulse chain - for a true-to-life signal transmission.