For the
connection to
audio devices

Problem of electrical interference of audio devices

Via power supplies, transformers, etc. the hi-fi devices themselves generate electrical interfering fields, in the immediate vicinity of the signal-transmitting components. In addition, the different power consumptions of the individual devices cause sound-damaging potential equalization currents, which are distributed to all devices via the cable connections. Furthermore, via the cables and device housings high frequency interfering fields from the environment radiate directly into the signal path of the devices and massively degrade sound reproduction quality.

Common solution approaches and their limitations:

In order to protect the sensitive audio signal inside the devices against impairment, developers of high grade devices try hard to keep interfering fields low inside of the devices by use of very low stray field components or by shielding enclosures. Power filter or grid generators may help keep external interfering fields originated from the power grid away from the device, but the inner interfering fields, caused by the equipment itself and close to the audio signal, cannot be cleared up this way.

High-frequency interfering fields, radiating from the environment via the housings of the Hi-Fi devices and the cables into the signal path, are not detected at all by upstream filters.

Previous ground solutions work by reducing potential equalization currents by discharging to protective grounding or a common central ground potential. Due to the nature of the system, such ground solutions do not have bidirectional connection lines to prevent interfering field transmission between the audio devices.

In addition, any discharging to protective grounding opens another window for interferences already present on protective ground to enter the audio system.

for the audio devices

ATOMIC BONDING vs. Monocyrstaline OCC / UPOCC Conductors

In contrast to the often only temporarily effective advantages of established treatment and manufacturing processes on the reproduction quality of high-quality audio cables, e.g. cryogenization or OCC or UPOCC casting processes, SCHNERZINGER cables with ATOMIC BONDING conductors enable an audibly purer and unrivaled true-to-life signal transmission - and this permanently! 

In order to recognize the essential advantage of the SCHNERZINGER ATOMIC BONDING technology compared to conventional methods, some background knowledge about the industrial processing of wires used as conductor material in the audio sector is required:


To manufacture the conductor material in most audio cables, thick copper or silver strands are repeatedly drawn through so-called drawing dies until the wires are thin enough for further use. Every drawing process means enormous mechanical stress, which causes the crystalline grain structure of the wires to disintegrate into many crystals. In a sense, the audio signals have to find their way through many of these grain structures. The flow through the grain boundaries from grain to grain creates an enormous resistance potential every time, which is known to cause slowed signal transport.

The more complex casting process is therefore often used for higher-quality audio cables. Here, liquid copper or silver is continuously poured into molds, which results in longer grain structures. In the even more complex monocrystalline OCC or UPOCC (Ultra-Pure Ohno Continuous Casting) process, the molds are even heated and slowly cooled to prevent the material from solidifying too quickly. This process was developed by Prof. Ohno in the 1980s for industry so that fewer cracks occur in the sheet metal when the copper strands are rolled out


SCHNERZINGER ATOMIC BONDING, on the other hand, takes a completely different approach:

To easily get the idea of the innovative development approach ATOMIC BONDING, simply envision a conducting wire as a pipe filled with ice cubes, whereby the ice cubes symbolically illustrate the inner grain structure of the wire.

Since long-chain metal structures are quite sensitive and easily disintegrate again after the manufacturing process, e.g. due to vibrations and bending processes, ATOMIC BONDING is a technologically extremely complex process which does not aim at bonding individual ice cubes to form a closed, long-chain monostructure, but on the contrary at crushing the cubes. This results in the smallest ice structure components, which can subsequently be compressed into a stable, homogeneous ice mass with very high cohesive forces in the tube.

A compacted, fused mass of ice has a closed, extremely stable structure - without any gaps. This fact forms the basis for a highly pure and perfect impulse chain - for a true-to-life signal transmission.