PROTECTORS and GUARDS effectively protect against
burdensome high-frequency degradation of the pure audio signal

With the PROTECTORS and GUARDS and their integrated trendsetting GIGA CANCELING technology SCHNERZINGER has developed products, that eliminate sound impairment on the sensitive audio signal caused by modern high-frequency interfering fields (e. g. WLAN, mobile communications, power lines, etc.). The inevitable loss of resolution, dynamics and musicality is effectively prevented. SCHNERZINGER offers comprehensive protection for the audio signal against

  • interfering fields affecting the signal path via the power grid
  • inner interfering fields generated by the audio components themselves
  • external interfering fields affecting the room environment 


For the first time, an audiophile listener has a truly authentic and completely unclouded musical listening experience.  

Products for the power grid

SCHNERZINGER PROTECTORS and GUARDS for the power grid (POWER) protect the integrity of the audio signal by unrivaled cleaning of the power from massive irradiation of low and high frequency electrical interfering fields - completely without the compromised disadvantages of conventional power cleaners and line filters for a music reproduction quality that is as 100% accurate as possible 

COMPONENT - Products for the audio equipment

The PROTECTORS and GUARDS for the connection to the HiFi components (COMPONENT) actively protect the sensitive audio signal from degrading interfering field influences inside the devices and expand existing ground solutions with a bidirectional connection line, minimizing complex equalizing currents and grounding disturbances between the individual components of the chain

Products for the Hifi-Room

Every HiFi room is different, but the problem of high-frequency interfering fields and the influence on the unclouded music enjoyment in a modern living environment almost always exist. The SCHNERZINGER PROTECTORS and GUARDS for the HiFi room (ROOM) cleverly use the technologies we have established to create a flexible and effective protective shield against critical interfering field peaks in the HiFi room or at the listening position. 

Product Overview PROTECTORS & GUARDS

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ATOMIC BONDING vs. Monocyrstaline OCC / UPOCC Conductors

In contrast to the often only temporarily effective advantages of established treatment and manufacturing processes on the reproduction quality of high-quality audio cables, e.g. cryogenization or OCC or UPOCC casting processes, SCHNERZINGER cables with ATOMIC BONDING conductors enable an audibly purer and unrivaled true-to-life signal transmission - and this permanently! 

In order to recognize the essential advantage of the SCHNERZINGER ATOMIC BONDING technology compared to conventional methods, some background knowledge about the industrial processing of wires used as conductor material in the audio sector is required:


To manufacture the conductor material in most audio cables, thick copper or silver strands are repeatedly drawn through so-called drawing dies until the wires are thin enough for further use. Every drawing process means enormous mechanical stress, which causes the crystalline grain structure of the wires to disintegrate into many crystals. In a sense, the audio signals have to find their way through many of these grain structures. The flow through the grain boundaries from grain to grain creates an enormous resistance potential every time, which is known to cause slowed signal transport.

The more complex casting process is therefore often used for higher-quality audio cables. Here, liquid copper or silver is continuously poured into molds, which results in longer grain structures. In the even more complex monocrystalline OCC or UPOCC (Ultra-Pure Ohno Continuous Casting) process, the molds are even heated and slowly cooled to prevent the material from solidifying too quickly. This process was developed by Prof. Ohno in the 1980s for industry so that fewer cracks occur in the sheet metal when the copper strands are rolled out


SCHNERZINGER ATOMIC BONDING, on the other hand, takes a completely different approach:

To easily get the idea of the innovative development approach ATOMIC BONDING, simply envision a conducting wire as a pipe filled with ice cubes, whereby the ice cubes symbolically illustrate the inner grain structure of the wire.

Since long-chain metal structures are quite sensitive and easily disintegrate again after the manufacturing process, e.g. due to vibrations and bending processes, ATOMIC BONDING is a technologically extremely complex process which does not aim at bonding individual ice cubes to form a closed, long-chain monostructure, but on the contrary at crushing the cubes. This results in the smallest ice structure components, which can subsequently be compressed into a stable, homogeneous ice mass with very high cohesive forces in the tube.

A compacted, fused mass of ice has a closed, extremely stable structure - without any gaps. This fact forms the basis for a highly pure and perfect impulse chain - for a true-to-life signal transmission.