Problem of electrical interference of cable

The cables of the audio system - in particular shielded - act like antennas, almost attracting high-frequency electrical interfering fields from the environment caused by WLAN, mobile phones, DECT phones, etc. and conducting them directly into the signal path of the devices.

Darüber hinaus verteilen handelsübliche Kabel ohne bidirektionale Sperrfunktion die aus dem Stromnetz und die von den Geräten selbst ausgehenden Störfelder auf alle mit ihnen verbundenen Geräte.

The antenna and distribution function of the cables massively and directly affects the quality of the devices thus being the sound killer of an audio system.

Today no longer the components of a cable but the effectiveness of its high-frequency protection concept determines the sound quality!

Interesting: a higher-quality conductor material transmits interfering fields even more effectively.

Previous solution approaches and their limitations:

Although shielding meshwork and foils keep low-frequency interfering fields away from the conductor, they increase the antenna effect of cables for high-frequency interfering fields.

Discharging to protective grounding opens the door for interfering fields already present on protective earth.

Series as well as parallel filters, capacitors and diodes, which are commonly used in or on cables, are designed to minimize interfering fields, but tend to slow down electrons and delay transmission, reducing bandwidth and speed of signal transmission throughout the audio system.

The compromises of these solution approaches may be the lesser evil with regard to their benefits; the comparison to the SCHNERZINGER solution clearly shows the limits.



Each SCHNERZINGER cable forms a bidirectional barrier when used in conjunction with a CABLE PROTECTOR, without reducing signal bandwidth or electron flow at all:

  • external interfering fields radiating from the power grid or the cables are blocked
  • internal electrical interfering fields caused by the Hi-Fi devices themselves are not transferred to other Hi-Fi devices but dissipated outwards


SCHNERZINGER CABLE PROTECTION protects and preserves signal speed and bandwidth of the entire audio system.

Each SCHNERZINGER cable can be used on its own. But using SCHNERZINGER products throughout will result in a closed system in which the bidirectional effect remains uninterrupted.

By use of ATOMIC BONDING conductor material and CABLE PROTECTION, SCHNERZINGER cables of the latest TS generation achieve a unique transmission quality, thereby redefining audiophile parameters such as resolution, soundstage, dynamics and musicality.

ATOMIC BONDING vs. Monocyrstaline OCC / UPOCC Conductors

In contrast to the often only temporarily effective advantages of established treatment and manufacturing processes on the reproduction quality of high-quality audio cables, e.g. cryogenization or OCC or UPOCC casting processes, SCHNERZINGER cables with ATOMIC BONDING conductors enable an audibly purer and unrivaled true-to-life signal transmission - and this permanently! 

In order to recognize the essential advantage of the SCHNERZINGER ATOMIC BONDING technology compared to conventional methods, some background knowledge about the industrial processing of wires used as conductor material in the audio sector is required:


To manufacture the conductor material in most audio cables, thick copper or silver strands are repeatedly drawn through so-called drawing dies until the wires are thin enough for further use. Every drawing process means enormous mechanical stress, which causes the crystalline grain structure of the wires to disintegrate into many crystals. In a sense, the audio signals have to find their way through many of these grain structures. The flow through the grain boundaries from grain to grain creates an enormous resistance potential every time, which is known to cause slowed signal transport.

The more complex casting process is therefore often used for higher-quality audio cables. Here, liquid copper or silver is continuously poured into molds, which results in longer grain structures. In the even more complex monocrystalline OCC or UPOCC (Ultra-Pure Ohno Continuous Casting) process, the molds are even heated and slowly cooled to prevent the material from solidifying too quickly. This process was developed by Prof. Ohno in the 1980s for industry so that fewer cracks occur in the sheet metal when the copper strands are rolled out


SCHNERZINGER ATOMIC BONDING, on the other hand, takes a completely different approach:

To easily get the idea of the innovative development approach ATOMIC BONDING, simply envision a conducting wire as a pipe filled with ice cubes, whereby the ice cubes symbolically illustrate the inner grain structure of the wire.

Since long-chain metal structures are quite sensitive and easily disintegrate again after the manufacturing process, e.g. due to vibrations and bending processes, ATOMIC BONDING is a technologically extremely complex process which does not aim at bonding individual ice cubes to form a closed, long-chain monostructure, but on the contrary at crushing the cubes. This results in the smallest ice structure components, which can subsequently be compressed into a stable, homogeneous ice mass with very high cohesive forces in the tube.

A compacted, fused mass of ice has a closed, extremely stable structure - without any gaps. This fact forms the basis for a highly pure and perfect impulse chain - for a true-to-life signal transmission.