"A perfect match with Schnerzinger Interconnects..."

"The Spectral top-of-the-line preamplifier DMC 30SS II as well as the Spectral Monos 360 SII were connected with MIT cables as strongly recommended by the manufacturer, and the best from MIT: the Oracle MA-X Rev.2 (12,000 euros). The speaker cable was also the best MIT has to offer: Oracle MA-X SHD for 45.000 Euro. At the end of this cable two Magico Q3 are working.

Spectral + MIT + Magico is, according to the manufacturer, the dream combination.... I thought so too, until I heard the Schnerzinger interconnects and speaker cables. Long story short: now an 8000 LS cable and an 8000 and 5000 interconnect from Schnerzinger play - and significantly !!!!!!!!!! better, more differentiated and above all more natural than the "dream combination" before.

It is a pleasure to listen to music now!"

Eugen M.

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ATOMIC BONDING vs. Monocyrstaline OCC / UPOCC Conductors

In contrast to the often only temporarily effective advantages of established treatment and manufacturing processes on the reproduction quality of high-quality audio cables, e.g. cryogenization or OCC or UPOCC casting processes, SCHNERZINGER cables with ATOMIC BONDING conductors enable an audibly purer and unrivaled true-to-life signal transmission - and this permanently! 

In order to recognize the essential advantage of the SCHNERZINGER ATOMIC BONDING technology compared to conventional methods, some background knowledge about the industrial processing of wires used as conductor material in the audio sector is required:

CONVENTIONAL CASTING METHODS:

To manufacture the conductor material in most audio cables, thick copper or silver strands are repeatedly drawn through so-called drawing dies until the wires are thin enough for further use. Every drawing process means enormous mechanical stress, which causes the crystalline grain structure of the wires to disintegrate into many crystals. In a sense, the audio signals have to find their way through many of these grain structures. The flow through the grain boundaries from grain to grain creates an enormous resistance potential every time, which is known to cause slowed signal transport.

The more complex casting process is therefore often used for higher-quality audio cables. Here, liquid copper or silver is continuously poured into molds, which results in longer grain structures. In the even more complex monocrystalline OCC or UPOCC (Ultra-Pure Ohno Continuous Casting) process, the molds are even heated and slowly cooled to prevent the material from solidifying too quickly. This process was developed by Prof. Ohno in the 1980s for industry so that fewer cracks occur in the sheet metal when the copper strands are rolled out

INNOVATIVE APPROACH WITH ATOMIC BONDING:

SCHNERZINGER ATOMIC BONDING, on the other hand, takes a completely different approach:

To easily get the idea of the innovative development approach ATOMIC BONDING, simply envision a conducting wire as a pipe filled with ice cubes, whereby the ice cubes symbolically illustrate the inner grain structure of the wire.

Since long-chain metal structures are quite sensitive and easily disintegrate again after the manufacturing process, e.g. due to vibrations and bending processes, ATOMIC BONDING is a technologically extremely complex process which does not aim at bonding individual ice cubes to form a closed, long-chain monostructure, but on the contrary at crushing the cubes. This results in the smallest ice structure components, which can subsequently be compressed into a stable, homogeneous ice mass with very high cohesive forces in the tube.

A compacted, fused mass of ice has a closed, extremely stable structure - without any gaps. This fact forms the basis for a highly pure and perfect impulse chain - for a true-to-life signal transmission.