The TS-Line, which has been successful for many years, is Schnerzinger's "harmony" line, so to speak.
Although it plays very precisely and lively, nothing can upset it. The TS-Line performs reliably in almost all hi-fi constellations, its harmonic charisma draws attention to the merits of the audio setup and not to the weaknesses. Its natural sound with a great deal of detail and openness has been convincing our customers for years.
As with all its cable series, Schnerzinger also relies here on ATOMIC BONDING and BIDIRECTIONAL BARRIER. These technologies have been optimized again and again by the team in years of development work down to the last detail.
The result is a transmission quality that makes Schnerzinger Kabel so unique.
Recommendation: The CABLE PROTECTOR, available as an accessory, as an effective booster for the bidirectional barrier, provides the icing on the cake.
The build-up grades of the line, REFERENCE TS (1000, 2000, 3000) and EXTREME TS (5000, 8000, 10000) are available in the following versions :
POWER – RCA – XLR – PHONO – SPEAKER – SPDIF (75Ω) – AES/EBU (110Ω) – BNC
Schnerzinger GmbH & Co KGHeinrich-Sträter Str. 1544229 Dortmund
ContactTelefon: +49 (231) 133 850-15Mail: email@example.com
In contrast to the often only temporarily effective advantages of established treatment and manufacturing processes on the reproduction quality of high-quality audio cables, e.g. cryogenization or OCC or UPOCC casting processes, SCHNERZINGER cables with ATOMIC BONDING conductors enable an audibly purer and unrivaled true-to-life signal transmission - and this permanently!
In order to recognize the essential advantage of the SCHNERZINGER ATOMIC BONDING technology compared to conventional methods, some background knowledge about the industrial processing of wires used as conductor material in the audio sector is required:
CONVENTIONAL CASTING METHODS:
To manufacture the conductor material in most audio cables, thick copper or silver strands are repeatedly drawn through so-called drawing dies until the wires are thin enough for further use. Every drawing process means enormous mechanical stress, which causes the crystalline grain structure of the wires to disintegrate into many crystals. In a sense, the audio signals have to find their way through many of these grain structures. The flow through the grain boundaries from grain to grain creates an enormous resistance potential every time, which is known to cause slowed signal transport.
The more complex casting process is therefore often used for higher-quality audio cables. Here, liquid copper or silver is continuously poured into molds, which results in longer grain structures. In the even more complex monocrystalline OCC or UPOCC (Ultra-Pure Ohno Continuous Casting) process, the molds are even heated and slowly cooled to prevent the material from solidifying too quickly. This process was developed by Prof. Ohno in the 1980s for industry so that fewer cracks occur in the sheet metal when the copper strands are rolled out
INNOVATIVE APPROACH WITH ATOMIC BONDING:
SCHNERZINGER ATOMIC BONDING, on the other hand, takes a completely different approach:
To easily get the idea of the innovative development approach ATOMIC BONDING, simply envision a conducting wire as a pipe filled with ice cubes, whereby the ice cubes symbolically illustrate the inner grain structure of the wire.
Since long-chain metal structures are quite sensitive and easily disintegrate again after the manufacturing process, e.g. due to vibrations and bending processes, ATOMIC BONDING is a technologically extremely complex process which does not aim at bonding individual ice cubes to form a closed, long-chain monostructure, but on the contrary at crushing the cubes. This results in the smallest ice structure components, which can subsequently be compressed into a stable, homogeneous ice mass with very high cohesive forces in the tube.
A compacted, fused mass of ice has a closed, extremely stable structure - without any gaps. This fact forms the basis for a highly pure and perfect impulse chain - for a true-to-life signal transmission.